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U1 · IDENTITY

Package: MCU-64 · Family: HUMAN · Rev A

Willow Kim
JUNIOR ECE @ OHIO STATE // SEEKING SUMMER 2027 INTERNSHIP

Hi! I'm an Electrical and Computer Engineering student at The Ohio State University with hands-on experience in RF/analog circuits, wearable sensing systems, embedded firmware, PCB design, and hardware verification.

Through two years of research at the ElectroScience Laboratory and internship experience at Medtronic (early-stage R&D) and Johnson & Johnson MedTech (late-stage product development), I developed skills in board-level design, early-stage development prototyping, signal processing, debugging, VNA/oscilloscope validation, geometry modeling, and regulated technical documentation.

Interested in contributing to consumer electronics hardware where sensors, electrical systems, firmware, and product experience come together.

I care about how a product looks and feels in someone's hand, not just whether it boots. I switched from neuroscience to ECE sophomore year because I wanted to build the things that interface with people, and I've been chasing that ever since.

CREDENTIALS
GPA 3.95 / 4.0 B.S. ECE, FALL 2027 HAROLD F. MATHIS MEMORIAL SCHOLAR IN EE STEP FELLOW · $2K RESEARCH FELLOWSHIP (2025) COLLEGE OF ENGINEERING DEPT. AMBASSADOR ELECTROSCIENCE LAB UNDERGRAD RESEARCHER
AREAS OF INTEREST
ROBOTICS MEDTECH CONSUMER HARDWARE PCB DESIGN ANALOG / RF CIRCUITS DIGITAL TWIN / SIMULATION
SKILLS
PCB DESIGN
4-layer layout, schematic capture, RF / impedance-matched routing, EasyEDA & KiCad, 0603 soldering, dev board bring-up
EMBEDDED SYSTEMS
BLE firmware (nRF52840), I²C, SPI, UART, C/C++, Python
ANALOG / RF & SIGNAL PROCESSING
Chebyshev filter design, PPG signal processing (MATLAB), impedance matching
SIMULATION & MODELING
LTspice, parameterized geometry generation, digital twin / biomedical simulation
TEST & MEASUREMENT
VNA (S21), oscilloscope, power supplies
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> EXPERIENCE.chip / die view

U2 · CO-OP + INTERNSHIPS

Contents: 2 sub-components · Interconnect: professional

ACTIVE

MEDTRONIC

R&D INTERN · 2026 · [LOCATION +]

Supported early-stage medical device R&D through physiological signal processing and computational modeling work. My projects involved processing PPG data, building analysis workflows, and applying statistical methods to characterize signal behavior across experimental conditions.

I developed modeling tools for vascular geometry studies and gained experience with biomedical simulation (digital twin), parameterized geometry generation, and research-oriented engineering workflows.

SKILL PINS
MATLAB SIGNAL PROCESSING PPG DATA COLLECTION LABCHART STATISTICAL ANALYSIS BIOMEDICAL SIMULATION DIGITAL TWIN PARAMETERIZED GEOMETRY EARLY-STAGE R&D
Medtronic
R&D Intern · 2026

JOHNSON & JOHNSON MEDTECH

ELECTRICAL ENGINEER CO-OP · CINCINNATI · SPRING 2026

Worked on the DUALTO™ Surgical Energy System team, supported calibration fixture testing, verification, and technical documentation for internal engineering use. My work included creating operating procedures, contributing to software validation documentation, and collecting test case data to support fixture verification, with documentation formally reviewed and signed through the team's internal document-control process.

Alongside the fixture work, I got to design a 4-layer ATmega32u4 development board, where I gained skills in board design with KiCad and constructed a design plan within a set time frame, including block diagram development, schematic design, PCB layout, assembly, and bootloader flashing. This board is detailed further in the Projects section below.

SKILL PINS
CALIBRATION FIXTURE TESTING VERIFICATION SW VALIDATION DOCUMENTATION OPERATING PROCEDURES TEST CASE DATA COLLECTION DOCUMENT CONTROL PCB SCHEMATICS + LAYOUT DEV BOARD BRING-UP
Johnson & Johnson MedTech co-op
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> PROJECTS.chip / die view

U3 · RESEARCH + BUILD

Contents: 2 sub-components · one presenting at IEEE AP-S this month

4-LAYER DEV BOARD · ATmega32u4

CUSTOM PCB · J&J MEDTECH CO-OP · SPRING 2026

An end-to-end PCB design project in KiCad, taken from block diagram to a working, bootloader-flashed board.

The board is a 4-layer, 2000 × 700 mil ATmega32u4 (7×7 VQFN) dev board. Core blocks: USB-C for power and serial, a voltage regulator feeding the MCU rail, an I²C level shifter into a proximity sensor, NeoPixel LEDs, an oscillator, and a reset button. USB-C was chosen so the board could be powered, programmed, and serial-debugged over a single connector, with the ISP pins (SCK, PDO, PDI, RESET) mapped explicitly before layout.

Layout went through two full revisions after design review, tightening placement and routing around the MCU. From there: wrote the assembly and test plans, ordered parts, hand-assembled the board, inspected the QFN joints under a microscope, verified continuity, and flashed the bootloader.

The board runs a closed-loop demo: the proximity sensor streams distance over I²C, and the firmware maps that reading to NeoPixel brightness in real time.

CORE BLOCKS
ATmega32u4 MCU · 7×7 VQFN USB-C PWR · SERIAL V-REG MCU RAIL OSC RESET LVL SHIFT I²C PROX SENSOR NEOPIXEL
SKILL PINS
KiCad 4-LAYER LAYOUT SCHEMATIC CAPTURE ATmega32u4 / VQFN I²C LEVEL SHIFTING POWER REGULATION USB-C INTERFACE ASSEMBLY / TEST PLANS SMD SOLDERING BOOTLOADER FLASHING FAILURE ANALYSIS
Assembled 4-layer ATmega32u4 dev board with USB-C, red soldermask
Assembled board on breadboard, hand-soldered
DEMO
Proximity sensor output drives NeoPixel brightness · I²C over level shifter
SELECTED EARLIER PROJECTS
CHOPMATE · ASSISTIVE CUTTING DEVICE (ENGR II) VANTARI · PHOTOBIOMODULATION EARPIECE [+ add]